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High-Precision Laser Cutter for Advanced Semiconductor and Solar Wafer Processing

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Yoha (Wuhan) New Energy Technology Co., Ltd.
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Country/Region:china
Contact Person:MrJohn Yang
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High-Precision Laser Cutter for Advanced Semiconductor and Solar Wafer Processing

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Brand Name :YOHA
Model Number :YHC-30
Certification :CE
Place of Origin :China
MOQ :1
Price :Contact Us
Payment Terms :L/C,D/A,D/P,T/T,Western Union,MoneyGram
Packaging Details :Wooden cases
Cell Size :156 166 182 210mm Cells
Laser Source :1064nm
precision :≤0.02mm
scribing speed :600mm/s
Service life :≥ 100000 H
Energy consumption :≤ 1000W
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High-Precision Laser Cutter for Advanced Semiconductor and Solar Wafer Processing

Technical specifications:


Application Overview

Category Description
Primary Use The High-Precision Laser Cutter performs ultra-fine cutting of solar semiconductor silicon wafers, ceramic substrates, and irregular cells (125–210mm).
Integration The 1064nm Fiber Laser Cutting System integrates seamlessly into solar panel production lines, minimizing surface damage.
Industry Focus Optimized for Semiconductor Wafer Laser Cutting and solar cell scribing via the Automatic Solar Cell Laser Scribing Machine.


Key Features

Feature Technical Detail
Laser Source 1064nm Fiber Laser Cutting System with beam quality ㎡ < 1.3 for unmatched precision.
Scribing Precision ≤0.02mm accuracy and ≤0.03mm width, enabled by the High-Precision Laser Cutter.
Efficiency Dual-station scribing at 600mm/s, processing <1500pcs/h with 2 loading trays.
Energy Savings ≤1000W power consumption and ≥35% electro-optical efficiency.
Durability Maintenance-free enclosed optics; ≥100,000-hour laser lifespan.
Compact Design 1300mm footprint, air-cooled operation, and compatibility with dust-free environments.


Technical Specifications

Parameter Detail
Laser Output Fundamental mode with ≤3% power stability.
Worktable 700x400mm stroke; glass table for stable Semiconductor Wafer Laser Cutting.
Voltage 220VAC/50Hz
Environmental Operates at 5–30°C, <75% humidity; vibration/magnetic interference-free.
Compatibility Handles whole, non-standard, rice-grain, and missing-corner cells.
Compressed Air 0.5-0.8MPa



Environmental Requirements

Requirement Specification
Workspace Dust-free, air-conditioned area for Fiber Laser Cutting Machine accuracy.
Temperature 5–30°C
Installation Minimal vibration/magnetic interference to protect Automatic Solar Cell Laser Scribing Machine performance.
Humidity <75%



Our Services:

High-Precision Laser Cutter for Advanced Semiconductor and Solar Wafer Processing

About Us:
High-Precision Laser Cutter for Advanced Semiconductor and Solar Wafer Processing
Yoha Solar is a high-tech enterprise dedicated to the research, development, manufacturing, sales, and after-sales service of serial photoelectric automation equipment.
15+
Years Engaged In Solar
300+
Customers Worldwide
High-Precision Laser Cutter for Advanced Semiconductor and Solar Wafer Processing

Our company primarily serves the solar photovoltaic industry and holds its own import and export rights. We have developed a range of independent R&D equipment.

Main Machinery:Fiber Laser Cutting Machine
Solar cell sorting Machine
Solar Cell IV tester
EL defect tester
EL and AOI Appearance Tester
Solar Panel Production Line
Other Auxiliary Machines





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